Ciba Inc.
Klybeckstrasse 141, P.O. Box
Basel 4002
Switzerland

Tel.: +41 61 636 49 16
Fax.: +41 61 636 25 59


Events - Previews
 

Preview of Labelexpo Americas 2008 – Label bonanza!

Previews

11. Aug. 2008

By Ania Dardas

The Labelexpo Americas is the largest event for the label, product decoration, web printing and converting industry in the Americas. Taking place in Chicago from September 9 to 11, the fair offers many exciting insights into the latest technology: pressure sensitive developments; new materials - including everything you can do with film nowadays; printing at the cutting edge, with UV flexo and digital; added value solutions; innovative product decoration ideas and service optimization.

The Americas represent 40 percent of global label consumption and annual label growth is currently 7-8 percent, with great potential still to be tapped in Latin America.

This is the right place for all label converters, packaging producers, folding carton manufacturers, flexible packaging suppliers and general printers.

Labelexpo Americas labels

The show offers visitors a very broad range of solutions, products and opportunities to fulfil all their business needs.

The leaders of digital printing are all to be found at the Digital Printing Experience, while the Converting and Finishing Pavilion has a strong focus on flexible packaging. This year’s smart label zone is bigger than ever and this is where you’ll find out about the latest in brand protection, anti-counterfeiting and time/temperature indicators - among others. And the environment is represented in Gather on the Green for the latest in green and sustainable technology.

Labelexpo Americas logo

A selection of highly experienced speakers from the industry will be offering a conference program that covers the hottest areas of debate today, from management topics to the future of labels. Labelexpo Managing Director Roger Pellow says: “Labelexpo Americas provides a unique forum for converters in this market to get together and learn about the latest technologies and to explore new opportunities in the market.”



 
 

Comments on this article

no comments available

Send a friend

send a friend

Article successfully sent!